ETHERNET GROWING IN CHINA

December 5, 2013 - The Chinese market for industrial Ethernet & Fieldbus Technologies grew by 18 million nodes in 2012. More than 3 million nodes used Ethernet and the remainder used Fieldbus technology.

Although Fieldbus has a large base of new connected nodes in China, the usage of Fieldbus is not as common as in developed countries such as Germany or the United States. This is mainly because Chinese customers are encountering networking technology much later than those developing countries.

However, the growing speed of Ethernet is quite considerable in China and we think it is a great opportunity for Chinese customers to upgrade their automation system under current market condition. Customers will just jump from old Fieldbus Technologies direct to Ethernet now and actually many of them are doing right now.  The Chinese market is currently engaged in extensive upgrading and new infrastructure construction, and that will require a great deal of Ethernet applications.

refer to:http://www.automation.com/portals/industrial-networks-field-buses/industrial-ethernet-growing-in-china

High Computing Performance for All Applications- F.I.T. Technology

The demand for computing performance in the IPC market continues to become stronger as the IT field advances. Acrosser’s new AES-HM76Z1FL has been designed to meet these demands.

The F.I.T. Technology used to build this new product reflects its 3 major features: fanless design, Intel core i processor and ultra thin frame. The fanless design not only reduces the risk of exposure to air dust, but also prevents fan-malfunction. With a height of less than 0.8 inches, AES-HM76Z1FL’s slim design makes itself FIT into every application.

As its structure and output interface show, AES-HM76Z1FL provides a wide range of choices, from HDMI, VGA, USB, and audio to GPIO output interfaces that suit almost all industries. For wireless communication needs, the AES-HM76Z1FL has a mini-PCle expansion slot which provides support on both 3.5G and WiFi.

Another fascinating feature of the AES-HM76Z1FL is its ease of installation for expansions. By disassembling the bottom cover, expansions such as CF cards, memory upgrades and mini-PCIe can be easily complete without moving the heat sink. Moreover, Acrosser adopts 4 types of CPU (Intel Core i7/i3, Intel Celeron 1047UE/927UE) for AES-HM76Z1FL, allowing it to satisfy the scalable market demands of different applications.

In conclusion, the AES-HM76Z1FL is truly a well-rounded product designed for diverse applications. To promote our star product AES-HM76Z1FL, Acrosser will launch a product testing campaign starting in January, 2014. Acrosser will provide selected applications with the new AES-HM76Z1FL for one month, and it’s free! For more detailed information, please stay tuned for our press release, or leave us an inquiry on our website at www.acrosser.com!

Product Information:
http://www.acrosser.com/Products/Embedded-Computer/Fanless-Embedded-Systems/AES-HM76Z1FL/Intel-Core-i3／i7-AES-HM76Z1FL.html

Contact us：
http://www.acrosser.com/inquiry.html

Vendors have announced various services

Over the last few years a number of automation vendors have announced various services including outsourced maintenance, system integration, manufacturing and business process consulting, and remote operations. I wonder if an automation vendor can continue to be effective as both a product company and services provider.

To clarify the difference, let’s start by defining what I mean by services and products. By providing services, automation vendors engage with customers to perform labor and knowledge intensive tasks that may include system design, engineering services, system integration, preventative maintenance, remote operations, and other services. By providing products, automation vendors sell something to the customers, system integrators and engineering firms that they will apply to accomplish automation tasks in manufacturing and process environments.

Service Dynamics
The primary objective of a service company should be to focus on the development a system solution that is uniquely suited to the idiosyncrasies of the client’s business without being tethered by particular product solution offerings. A big part of this is the ability to deploy technologies from appropriate sources using integration and engineering skills to achieve a superior result for the client. Service businesses need to have effective and refined project, personnel, and quality management systems. The growth and effectiveness of these businesses is directly related to adding and managing smart people and this is a unique business proficiency mastered by successful service organizations. Pure service businesses have an advantage of successfully maintaining alliances with a range of product vendors that cannot be logically achieved by product vendors who provide services. This separation positions a pure service business to use best of breed and get the most out of vendors. For comparison, consider you are a smartphone user and the only place to get apps was your phone hardware vendor.

refer to:http://www.automation.com/portals/factory-discrete-automation/can-automation-vendors-serve-two-masters-products-services

Acrosser unveils its ultra slim fanless embedded system with 3rd generation Intel core i processor

Acrosser Technology Co. Ltd, a world-leading industrial and embedded computer designer and manufacturer, announces the new AES-HM76Z1FL embedded system. AES-HM76Z1FL, Acrosser’s latest industrial endeavor, is surely a FIT under multiple circumstances. Innovation can be seen in the new ultra slim fanless design, and its Intel core i CPU can surely cater for those seeking for high performance. Therefore, these 3 stunning elements can be condensed as "F.I.T. Technology." (Fanless, Intel core i, ultra Thin)

The heat sink from the fanless design provides AES-HM76Z1FL with great thermal performance, as well as increases the efficiency of usable space. The fanless design provides dustproof protection, and saving the product itself from fan malfunction. AES-HM76Z1FL has thin client dimensions, with a height of only 20 millimeters (272 mm x183 mm x 20 mm). This differs from most embedded appliances, which have a height of more than 50 millimeters.

The AES-HM76Z1FL embedded system uses the latest technology in scalable Intel Celeron and 3rd generation Core i7/i3 processors with a HM76 chipset. It features graphics via VGA and HDMI, DDR3 SO-DIMM support, complete I/O such as 4 x COM ports, 3 x USB3.0 ports, 8 x GPI and 8 x GPO, and storage via SATA III and Compact Flash. The AES-HM76Z1FL also supports communication by 2 x RJ-45 gigabit Ethernet ports, 1 x SIM slot, and 1 x MinPCIe expansion socket for a 3.5G or WiFi module.

Different from most industrial products that focus on application in one specific industry, the AES-HM76Z1FL provides solutions for various applications through the complete I/O interfaces. Applications of the AES-HM76Z1FL include: embedded system solutions, control systems, digital signage, POS, Kiosk, ATM, banking, home automation, and so on. It can support industrial automation and commercial bases under multiple circumstances.

Key features:
‧Fanless and ultra slim design
‧Support Intel Ivy Bridge CPU with HM76 chipset
‧2 x DDR3 SO-DIMM, up to 16GB
‧Support SATA III and CF storage
‧HDMI/VGA/USB/Audio/GPIO output interface
‧Serial ports by RS-232 and RS-422/485
‧2 x GbE, 1 x SIM, and 1 x MiniPCIe(for3G/WiFi)

Product Information:

http://www.acrosser.com/Products/Embedded-Computer/Fanless-Embedded-Systems/AES-HM76Z1FL/Intel-Core-i3／i7-AES-HM76Z1FL.html

Contact us：

http://www.acrosser.com/inquiry.html

Transitioning to new standards using model-based design

The impact of the new standards to UAV developers using model-based design is especially significant. Before describing this, an introduction to model-based design is appropriate.
Introduction to model-based design
With model-based design, UAV engineers develop and simulate system models comprised of hardware and software using block diagrams and state charts, as shown in Figures 1 and 2. They then automatically generate, deploy, and verify code on their Embedded Systems. With textual computation languages and block diagram model tools, one can generate code in C, C++, Verilog, and VHDL languages, enabling implementation on MCU, DSP[], FPGA[], and ASIC hardware. This lets system, software, and hardware engineers collaborate using the same tools and environment to develop, implement, and verify systems. Given their auto-nomous nature, UAV systems heavily employ closed-loop controls, making system modeling and closed-loop simulation, as shown in Figures 1 and 2, a natural fit.
Testing actual UAV systems via ground-controlled flight tests is expensive. A better way is to test early in the design process using desktop simulation and lab test benches. With model-based design, verification starts as soon as models are created and simulated for the first time. Tests cases based on high-level requirements formalize simulation testing. A common verification workflow is to reuse the simulation tests throughout model-based design as the model transitions from system model to software model to source code to executable object code using code generators and cross-compilers.
An in-the-loop testing strategy is often used as itemized below and summarized in Table 2:
1. Simulation test cases are derived and run on the model using Model-In-the-Loop (MIL) testing.
2. Source code is verified by compiling and executing it on a host computer using Software-In-the-Loop (SIL) testing.
3. Executable object code is verified by cross-compiling and executing it on the embedded processor or an instruction set simulator using Processor-In-the-Loop (PIL) testing.
4. Hardware implementation is verified by synthesizing HDL and executing it on an FPGA using FPGA-In-the-Loop (FIL) testing.

5. The embedded system is verified and validated using the original plant model using Hardware-In-the-Loop (HIL) testing.
A requirements-based test approach with test reuse for models and code is explicitly described in ARP4754A, DO-178C, and DO-331, the model-based design supplement to DO-178C.

refer to:
http://mil-embedded.com/articles/transitioning-do-178c-arp4754a-uav-using-model-based-design/

Almost half of Industrial automation sales in Asia

A recent report by IHS has shown that in 2012, capital expenditure on industrial automation equipment in Asia reached a total of $76.6bn, representing 46% of global investments in the sector.

Despite this established and rising trend, selling automation computers equipment in Asia remains a clear business opportunity and one where many European providers are lagging behind.

In order to help businesses better understand how to take advantage of the current climate and increase their industrial automation sales in Asia, particularly China, the CC-Link Partner Association (CLPA) is hosting a seminar entitled ‘Gateway to China’. The event will take place on 24th September at the Mitsubishi Electric Europe Tokyo Conference Suite in Hatfield.

In light of the sensitive current economic climate, many Asian companies are taking a more careful approach to investment – they are becoming more demanding towards their suppliers and making more enquiries before purchasing. Furthermore, according to IHS’ research, several Chinese manufacturers are currently developing products which are in direct competition with the ones provided by Western suppliers of industrial automation. These are only a few of the obstacles facing European vendors who want to penetrate the Asian market to change the way they do business.


Flexibility and the ability to respond to very specific demands are becoming essential factors when dealing with the Asian market. Being able to offer technologies and solutions which are compatible with the needs of Asian clients is no longer an option, it’s a must.

refer to:http://www.connectingindustry.com/automation/asia-claims-almost-half-of-automation-sales.aspx

Register Protection under main event

Register Protection
There may be modules in the design whose configuration should not change during the run phase of the chip, and in doing so may affect the proper operation of the system. One can disable access to these registers during run phase, or make such registers as write-once.

Redundant critical on-chip modules like processor, ISO, DMA controller, internal clock generator, and communications peripherals can improve reliability should a primary hardware module become non-functional while the vehicle is running. Such a system can have in-built error detection mechanisms and on-the-fly switching to redundant hardware to mitigate threats to passenger safety.
But this kind of redundant hardware architecture comes with the penalty of increased area and higher power management in silicon. Area penalties can be minimized by intelligent selection of which functions need to be duplicated in silicon. Power can be minimized by adopting power and clock gating in the redundant modules. Some  in-vehicle computers can be implemented in lock-step of each other, where primary and redundant modules process the same input. Mismatch in the output of the lock-step modules indicates a defect in either of the modules. The system can switch itself off or take appropriate safety measures to avoid any real-time failure. Redundant hardware should be placed quite far in silicon from the primary embedded systems to avoid tampering of both modules together.

refer to: http://www.edn.com/design/automotive/4421704/Safety---security-architecture-for-automotive-ICs